
January 2009
General Information DDR2 SDRAM
11 of 17
B
C
D
E
F
G
H
J
K
L
A
9.00 ± 0.10
6.40
0.80
1.60
# A1 INDEX MARK
0.80 x 8 =
123456789
3.20
11.00 ± 0.10
0.80
0.80
0.80
8.00x 10 =
4.00
(0.95)
(1.90)
60-∅0.45 Solder ball
0.2
M
AB
(Post reflow 0.50 ± 0.05)
(Datum A)
(Datum B)
A
B
MOLDING AREA
9.00 ± 0.10
11.00 ± 0.10
0.10MAX
0.35 ± 0.05
1.10 ± 0.10
Bottom
Top
60Ball FBGA for 512Mb E-die (x4/x8)
B
C
D
E
F
G
H
J
K
L
A
9.00 ± 0.10
6.40
0.80
1.60
# A1 INDEX MARK
0.80 x 8 =
123456789
3.20
13.00 ± 0.10
0.80
0.80
0.80
11.20x 14 =
5.60
(0.95)
(1.90)
84-∅0.45 Solder ball
0.2
M
AB
(Post reflow 0.50 ± 0.05)
(Datum A)
(Datum B)
A
B
MOLDING AREA
9.00 ± 0.10
0.10MAX
0.35 ± 0.05
1.10 ± 0.10
Bottom
Top
84Ball FBGA for 512Mb E-die (x16)
13.00 ± 0.10
M
N
P
R
#A1
#A1
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